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 导电黏合剂系列

SEM Paint, Paste, Aerosol - Conductive Adhesive

specimen preparation adhesives for scanning electron microscopy

 
conductive adhesive

PELCO® Conductive Graphite

available in water or alcohol base

Water Base (Carbon Paint)
Flat surface texture. Average flake size 1µm. Service temperature: 200°C.
MSDS

Prod #
Description
Unit
Price
16051
PELCO® Conductive Graphite, water base, 50g
each
P.O.R.


Isopropanol Base (Graphite Paint)
Flat surface texture. Average flake size 1µm. Service temperature: 65° C.
16053 MSDS 16054 MSDS

Prod #
Description
Unit
Price
16053
PELCO® Conductive Graphite, Isopropanol base, 30gm
each
P.O.R.
16054
Graphite Extender, 30ml
each
P.O.R.


 

electrodag

Electrodag 502

one component, ready to use

Electrostatic bleed for SEM non-conductive samples which require grounding.

502 is a combination of specially processed carbon particles in a fluoroelastomer resin system. It remains flexible over a temperature range of -40°C to 260°C and cures at room temperature. 502 resists oxidation and has good adhesion qualities. The diluent is methyl ethyl ketone (MEK) and has fluid consistency. Solids content is 12.6%. Maximum service temperature is 275°C.

The specimen mount surface should be clean and dry before application. Keep the container tightly capped when not in use and avoid breathing the vapor.
PELCO® Technical Notes, Electrodag® 502, 30g (PDF File)
MSDS

Prod #
Description
Unit
Price
16056
Electrodag 502, 30g
each
P.O.R.


silver paint

Composition:
1-Methoxy-2 Propanol base
60% Ag
Specific Gravity = 2.25 gm/cc.
Viscosity = 455 poise
 

PELCO® Conductive Liquid Silver

a reliable conductive ground path for SEM specimens

Air drying silver to make effective ground. Curable at room temperature and has high adhesion to any material. Surfaces do not have to be prepared prior to application and will adhere to such materials as polymer (phenolic) boards, ceramic, glass, metal, plastic and fiberglass. It should be mixed or spatulated well before using.

The container is offered in two sizes (15g and 30g) and is provided with an applicator brush. Silver flake grain size is an average of 80%, <1.0µm. Sheet resistance is 0.02 ohms per square @ 1 mil (0.001” = 0.025mm) thickness and is a function of the coating.

PELCO® Technical Notes, PELCO® Colloidal Silver, Product Numbers. 16031, 16034 (PDF File)

16031 MSDS - 16021 MSDS

Prod #
Description
Unit
Price
16031
PELCO® Colloidal Silver, 30g
each
P.O.R.
16034
PELCO® Colloidal Silver, 15g
each
P.O.R.

Prod #
Description
Unit
Price
16021
PELCO® SEM-Gold/Silver Extender, 25ml
each
P.O.R.

 

 leitsilber

 

"Leitsilber" Conductive Silver

a reliable conductive ground path for SEM specimens

Leitsilber is fast drying and has a flat surface texture.
Silver content 45%, Resistance: 0.02 - 0.04ohms/square. Drying time ~10 minutes at 20°C. Application can be by brush, dipping or spraying.

Maximum grain size: 16µm.
Maximum service temperature: 120°C. Consumption rate: 0.6 - 2g per 100cm2.
Refrigerate for best life. Bring to room temperature gradually.

MSDS

Prod #
Description
Unit
Price
16035
Leitsilber 200 Silver Paint, 30g
each
P.O.R.

 

   
colloidal silver
16032 PELCO® Colloidal Silver Paste and 15012 Specimen Preparation Stand

PELCO® Colloidal Silver Paste, Conductive

Ideal where a nonflowing paste is needed for special applications. Particle size: 0.4-1.0µm, 80% are below 1.0µm. Cures in 16-20 hours, or 30 minutes @125-150°C. Clear lacquer base. Approximate Sp Gr 2.25gm/cc. 

16032 MSDS - 16021 MSDS

PELCO® Technical Notes, PELCO® Colloidal Silver Paste, Product Number 16032 (PDF File)

Prod #
Description
Unit
Price
16032
PELCO® Colloidal Silver Paste, 25g
each
P.O.R.
16021
PELCO® SEM-Gold/Silver Extender, 25ml
each
P.O.R.



 

gold paste  

PELCO® Conductive Gold Paste

resistant to oxidation and retains measurement integrity over time

Gold paste is fast drying and useful for analytical analysis over time where a high signal is desired. The gold is in microfine form and contains organic binders and a solvent. Dries at room temperature. Not intended for permanent use, but for testing and temporary work. Resistance is about 30-40 ohms. Contacts hold down to very low temperatures (<-200°C), but are not permanent since this type of product has low mechanical strength. 75% gold content; sphere size <2µm, flake size <10µm. Maximum service temperature is 65°C.
Refrigerate for best life. Bring to room temperature gradually. Approximate calculated specific gravity 3.18gm/cc.

16022 MSDS - 16021 MSDS

Prod #
Description
Unit
Price
16022
PELCO® Conductive Gold Paste, 2g
each
P.O.R.
16021
PELCO® SEM-Gold/Silver Extender, 25ml
each
P.O.R.


 

  Aerodag G graphite aerosol

Graphite Aerosol

Forms a thin, uniform conductive surface when sprayed on the sample. Dries very quickly and can be used for low magnification imaging of un-conducitve samples.

Excellent adhesion to most plastics, glass and metals. Other applications are for use as a lubricant (use dry in vacuum systems) and for plating non-conductors.

10 oz. (283.5g)

PELCO® Technical Notes, Graphite Aerosol (pdf)

MSDS

Prod #
Description
Unit
Price
16058
Graphite Aerosol, 10 oz (284g)
each
P.O.R.


Leit C Plast

Leit C Plast

carbon base, good conductivity, large specimens

LEIT-C-Plast™ is a conductive adhesive that can be molded. Because of its relatively heavy paste consistency, larger samples can be held stationery for long periods when mounted on an electrical conductive adhesive station for SEM studies. The plasticity is permanent. It is not affected by high vacuum conditions and shows no peaks in energy dispersive X-ray microanalysis.

Heavy specimens may also be prepared for viewing in an SEM using Tempfix™ (or the Glue Gun - see details in our non-conductive section) and LEIT-C-Plast™. First the specimen is fixed into place with Tempfix™ or the Glue Gun. Afterward, an electrically conductive bridge is made between specimen mount and specimen using LEIT-C-Plast™. It is not required to wait for drying because neither adhesive outgasses.
LEIT-C-Plast™ was originally developed for holding specimens on angled specimen holders.
The adhesive is offered in a roll form and is black. Flat plates are provided for working the material. May be applied with a spatula.

Prod #
Description
Unit
Price
16046
Leit C Plast, 15g
each
P.O.R.



silver epoxy

EPO-TEK® Conductive Silver-Epoxy

Two Types:
silver resin paste / liquid hardener: H-22 Epo-Tek® (100:4.5 ratio)
silver resin paste / silver resin paste hardener: H20E Epo-Tek® (1:1 ratio)

General Properties
100% solids, two component silver filled epoxy with a soft, smooth, thixotropic (becoming less viscous when stirred or shaken) consistency designed specifically for chip bonding in microelectronic and optoelectronic applications.

Excellent handling, extremely long pot life at room temperature for this electrically conductive silver adhesive. High speed epoxy chip bonding systems are suitable for very fast cures, such as fast circuit repairs. Can be screen printed, machine dispersed or stamped and can withstand wire bonding temperatures in the range of 300 - 400°C.

Silver Conductive Epoxy, H-22 Epo-Tek®

Two component, silver-filled epoxy system, consisting of a silver resin paste and a liquid hardener (100:4.5). It is a free flowing paste, 100% solids system characterized by outstanding high temperature properties as well as excellent solvent, chemical and moisture resistance. It has a long pot life and is fast curing at relatively low temperatures. Containing no solvents or thinners; it will not outgas. It can be applied by brush, spatula or hypodermic needle. H-22 can be useful for small angle cleavage in material science and semi-conductor applications.
Epo-Tek® silver content is 60% by weight of composition. Note: Mixing ratio for this product is 100 parts silver resin paste to 4.5 parts liquid hardener.

CURE SCHEDULE
(minimum bond time/temperature)
150°C........5 minutes
120°C .......10 minutes
100°C .......20 minutes
80°C.........45 minutes
• Color: Silver
• Consistency: Smooth, flowing paste
• Glass Transition Temp (Tg): Cured at 150°C/1 hour typically >100°C
• Refrigeration: Not required.

MSDS Part A; MSDS Part B
PELCO® Technical Notes, H-22 Epo-Tek® Silver Conductive Epoxy (pdf)

Prod #
Description
Unit
Price
16016
Silver Conductive Epoxy, H22, 28.35g (1 oz.)
each
P.O.R.


Silver Conductive Epoxy, H2OE Epo-Tek®

Two component, silver filled, epoxy system consisting of a silver resin paste and a silver resin hardener (1:1). It is a smooth, thixotropic paste, 100% solids system characterized by outstanding high temperature properties and excellent solvent, chemical and moisture resistance. It has a long pot life and is fast curing at relatively low temperatures. Will withstand 200°C for 1,000 hours. Containing no solvents or thinners, it will not outgas. H20E is simple to use and ideal for electronic applications. Cures rapidly. Easy to use; the pure silver powder is dispersed in both the resin and the hardener so that it can be used in a convenient 1:1 mixing ratio. Non-toxic – complies with USP Class VI Biocompatibility standards. NASA approved.

CURE SCHEDULE
(minimum bond time)
175°C: 45 seconds; 150°C: 5 minutes; 120°C: 15 minutes; 80°C: 90 minutes
• Color: Bright Silver
• Consistency: smooth, thixotropic paste
• Glass Transition Temp (Tg): >80°C
• Cured at 150°C/1 hour: typically 100°C
• Continuous Operating temperature: 200°C
• Degradation Temperature: 410°C
• Refrigeration not required.

MSDS Part A; MSDS Part B
PELCO® Technical Notes, H20E Epo-Tek® Silver Conductive Epoxy (pdf)

Prod #
Description
Unit
Price
16014
Silver Conductive Epoxy, H20E, 28.35g (1 oz.)
each
P.O.R.

silver epoxy

Silver Conductive Epoxy

Strong, highly conductive solderless connections and repairs. Circuit boards. Static discharge shielding and grounding.

  • bonding surface mount components
  • high strength conductive bonds
  • quick, low or no heat cure – air dries
  • rework or remove with hot soldering iron
  • excellent electrical conductivity
  • 2-part epoxy, reusable applicator with stir stick, 7g each

MSDS Part A (PDF); MSDS Part B (PDF); Technical Notes (PDF)

Prod #
Description
Unit
Price
16043
Silver Conductive Epoxy
14g
P.O.R.


 

conductive pen

Circuit Repair with handy conductive pens
Silver Conductive Pens

Draws highly conductive silver traces, jumpers and shielding with high precision.

  • instantly creates conductive silver traces
  • dries in minutes at room temperature
  • valved pen tip for easy application
  • can be soldered at low temperature
  • speeds prototype and design
  • choice of tip sizes

MSDS (PDF); Technical Notes (PDF)

Prod #
Description
Unit
Price
16041
Silver Conductive Pen, standard, standard tip
each
P.O.R.
16042
Silver Conductive Pen, standard, micro tip
each
P.O.R.


 

silver paint

Fast Drying Silver Paint

This very fine flake silver is suspended in Iso-Butyl Methyl Ketone (4-Methylpentan-2-one) and forms a thin, smooth, highly conductive silver film which is both adherent and flexible. 30g.

PELCO® Technical Notes, Fast Drying Silver Suspension (pdf)

16040-30 MSDS - 16048-25 MSDS

Prod #
Description
Unit
Price
16040-30
Fast Drying Silver Paint, 30g
each
P.O.R.
16048-25
Silver Paint Diluent, 25ml
each
P.O.R.

conducting pen

Conducting Ink Pen

Leaves a mark which can be read in the electron beam in the SEM; can be used for marking or identifying objects

Prod #
Description
Unit
Price
16044
Conducting Ink Pen
each
P.O.R.

 

 

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